Surface treatment for Cu metallization on polyimide film by atmospheric pressure dielectric barrier discharge plasma system

Sang-Jin Cho; Shankar Prasad Shrestha; Jin‐Hyo Boo

doi:10.1016/j.cap.2011.04.024

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Surface treatment for Cu metallization on polyimide film by atmospheric pressure dielectric barrier discharge plasma system

Sang-Jin Cho Shankar Prasad Shrestha Jin‐Hyo Boo

Year: 2011 Journal: Current Applied Physics Vol: 11 (5)Pages: S135-S139 Publisher: Elsevier BV

DOI: 10.1016/j.cap.2011.04.024

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Keywords:

Polyimide Dielectric barrier discharge Materials science Atmospheric-pressure plasma Atmospheric pressure Dielectric Plasma Plasma cleaning Composite material Optoelectronics Meteorology Layer (electronics)

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Surface Modification and Superhydrophobicity

Physical Sciences → Materials Science → Surfaces, Coatings and Films

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Diamond and Carbon-based Materials Research

Physical Sciences → Materials Science → Materials Chemistry

Surface treatment for Cu metallization on polyimide film by atmospheric pressure dielectric barrier discharge plasma system

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