A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers

A. Bertz; Matthias Küchler; R. Knöfler; Thomas Geßner

doi:10.1016/s0924-4247(02)00006-7

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A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers

A. Bertz Matthias Küchler R. Knöfler Thomas Geßner

Year: 2002 Journal: Sensors and Actuators A Physical Vol: 97-98 Pages: 691-701 Publisher: Elsevier BV

DOI: 10.1016/s0924-4247(02)00006-7

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Keywords:

Wafer Fabrication Microelectromechanical systems Materials science Silicon Aspect ratio (aeronautics) Parasitic capacitance Capacitance Optoelectronics Microfabrication Nanotechnology

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Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Mechanical and Optical Resonators

Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics

Acoustic Wave Resonator Technologies

Physical Sciences → Engineering → Biomedical Engineering

A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers

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