Enhanced Thermal Conductivity of Epoxy Composites with MWCNTs/AlN Hybrid Filler

Abstract

To further improve the thermal conductivity of epoxy resin, the multi-walled carbon nanotube/aluminum nitride (MWCNTs/AlN) hybrid filler was employed to prepare thermal conductivity MWCNTs/AlN/epoxy composite by casting process, and the silane coupling reagent of γ-glycidoxy propyl trimethoxy silane(KH-560) was also used to functionalize the surface of MWCNTs and/or AlN. Results revealed that, the thermal conductivity of epoxy resin was improved remarkably with the addition of MWCNTs/AlN hybrid filler, a higher thermal conductivity of 1.04 W/mK could be achieved with 29 wt% MWCNTs/AlN hybrid filler (4 wt% MWCNTs +25 wt% AlN), about 5 times higher than that of native epoxy resin. And the epoxy composite with 29 wt% MWCNTs/AlN hybrid filler possessed better thermal conductivity and mechanical properties than those of single 5 wt% MWCNTs or 40 wt% AlN. The thermal decomposition temperature of MWCNTs/AlN/epoxy composite was increased with the addition of MWCNTs/AlN hybrid filler. For given filler loading, surface treatment of MWCNTs and/or AlN by KH-560 exhibited a positive effect on the thermal conductivity of epoxy composite.