Enhanced thermal conductivity of polymer composites filled with hybrid filler

Geon-Woong Lee; Min Park; Junkyung Kim; Jae Ik Lee; Ho Gyu Yoon

doi:10.1016/j.compositesa.2005.07.006

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Enhanced thermal conductivity of polymer composites filled with hybrid filler

Geon-Woong Lee Min Park Junkyung Kim Jae Ik Lee Ho Gyu Yoon

Year: 2005 Journal: Composites Part A Applied Science and Manufacturing Vol: 37 (5)Pages: 727-734 Publisher: Elsevier BV

DOI: 10.1016/j.compositesa.2005.07.006

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Keywords:

Materials science Composite material Filler (materials) Thermal conductivity Boron nitride Silicon carbide Whisker Composite number Thermal expansion Microelectronics Ceramic Epoxy Nanotechnology

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Topics

Thermal properties of materials

Physical Sciences → Materials Science → Materials Chemistry

Epoxy Resin Curing Processes

Physical Sciences → Engineering → Mechanical Engineering

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Enhanced thermal conductivity of polymer composites filled with hybrid filler

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