A novel method to overcome photoresist collapse with high aspect ratio structures

Mingyan Yu; Shirui Zhao; Chaoqun Gao; Xiaolong Guo; Xinwei Xu; Yunbo Shi; Yupeng Jing; Baoqin Chen

doi:10.1007/s00542-013-1903-z

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A novel method to overcome photoresist collapse with high aspect ratio structures

Mingyan Yu Shirui Zhao Chaoqun Gao Xiaolong Guo Xinwei Xu Yunbo Shi Yupeng Jing Baoqin Chen

Year: 2013 Journal: Microsystem Technologies Vol: 20 (12)Pages: 2185-2189 Publisher: Springer Science+Business Media

DOI: 10.1007/s00542-013-1903-z

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Keywords:

Photoresist Aspect ratio (aeronautics) Resist Materials science Lithography Surface tension Electron-beam lithography Cathode ray Carbon nanotube Optoelectronics Optics Nanotechnology Composite material Electron Physics

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Electrowetting and Microfluidic Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

A novel method to overcome photoresist collapse with high aspect ratio structures

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