JOURNAL ARTICLE

Formation of a Core/Shell Microstructure in Cu–Ni Thin Films

Zhu LiuLian GuoC. L. ChienPeter C. Searson

Year: 2008 Journal:   Journal of The Electrochemical Society Vol: 155 (9)Pages: D569-D569   Publisher: Institute of Physics

Abstract

Electrodeposition of Cu–Ni thin films can result in phase separation characterized by the formation of nodular features that exhibit a uniform columnar core/shell structure with a copper-rich core and nickel-rich shell. Here, we show that the core/shell microstructure is the result of differences in the nucleation and growth rates of the two components. In the potential range where the core/shell structure is observed, copper deposition is fast, resulting in the formation of a relatively low density of large hemispherical islands. Nickel deposition is characterized by slower kinetics, resulting in the formation of a high density of small islands surrounding the copper islands. These results provide a basis for understanding the formation of this core/shell microstructure in binary alloy systems.

Keywords:
Nucleation Microstructure Copper Shell (structure) Nickel Materials science Core (optical fiber) Deposition (geology) Alloy Thin film Metallurgy Phase (matter) Chemical engineering Chemical physics Composite material Nanotechnology Chemistry Geology

Metrics

22
Cited By
0.29
FWCI (Field Weighted Citation Impact)
33
Refs
0.62
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electrodeposition and Electroless Coatings
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Nanoporous metals and alloys
Physical Sciences →  Materials Science →  Materials Chemistry
Corrosion Behavior and Inhibition
Physical Sciences →  Materials Science →  Materials Chemistry

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