Lead-free solders: Reliability, an ongoing saga

Srinivas Chada

doi:10.1007/s11837-011-0176-1

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JOURNAL ARTICLE

Lead-free solders: Reliability, an ongoing saga

Srinivas Chada

Year: 2011 Journal: JOM Vol: 63 (10)Pages: 56-56 Publisher: Springer Science+Business Media

DOI: 10.1007/s11837-011-0176-1

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Keywords:

Whisker Soldering Interconnection Lead (geology) Electronics Materials science Electromigration Reliability (semiconductor) Engineering physics Mechanical engineering Manufacturing engineering Business Forensic engineering Metallurgy Computer science Engineering Electrical engineering Telecommunications Composite material

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Mechatronics Education and Applications

Physical Sciences → Engineering → Mechanical Engineering

Lead-free solders: Reliability, an ongoing saga

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