Die separation and packaging of a surface micromachined piezoresistive pressure sensor

Ingelin Clausen; O. Sveen

doi:10.1016/j.sna.2006.05.011

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Die separation and packaging of a surface micromachined piezoresistive pressure sensor

Ingelin Clausen O. Sveen

Year: 2006 Journal: Sensors and Actuators A Physical Vol: 133 (2)Pages: 457-466 Publisher: Elsevier BV

DOI: 10.1016/j.sna.2006.05.011

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Keywords:

Wafer dicing Wafer Piezoresistive effect Flip chip Microelectromechanical systems Interconnection Materials science Surface micromachining Pressure sensor Die (integrated circuit) Substrate (aquarium) Electronic engineering Wafer-level packaging Optoelectronics Mechanical engineering Computer science Nanotechnology Engineering Fabrication Layer (electronics) Adhesive

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Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Mechanical and Optical Resonators

Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics

Die separation and packaging of a surface micromachined piezoresistive pressure sensor

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