Failure Prevention on Application of Flexible Printed Circuits

Abstract

With the compact nature and the high electrical-connection density, flexible printed circuits (FPC) can achieve considerable weight, space and cost savings over the use of traditional rigid printed circuit boards. In recent years, it becomes impossible without flexible printed circuit technology in electronic products especially for Flip mobile phones. Whereas, its application is not always satisfied the engineering of assembly and reliability due to the existing of mechanical stress in soldering process and service environment. In this paper, through analyzing the common failures in mass production including via interconnection, trace crack and black pad, some preventions were suggested to improve the quality and reliability at the aspect of manufacture, process, mechanical design and dynamic stress distribution philosophy.