Flexible Printed Circuits (FPC) Structure and Requirements

Abstract

FPC (Flexible printed Circuit) is important key electronic component especially for advanced electronic equipment. Without FPC such as mobile phone (MP), digital still camera (DSC), video cam coder and digital versatile disk (DVD) could not be realized in a limited volume and weight. This article gives general view of FPC market size, structure, material, production process, Jisso (interconnection and packaging) technology and social requirement of FPC. Materials such as polyimide, LCP (Liquid Crystal Polymers), electro-deposited copper, rolled annealed copper, flame retardant adhesives play important roll. There are two kind of CCL (Copper Clad Laminates). One is 2-layer CCL the other is 3-layer CCL. 2-layer CCL is composed without adhesives. However adhesives are very key materials in FPC production. Flexibility of FPC is both advantage and disadvantage. Roll to Roll production method gives us high productivity to make on the other hand it has less flexibility to production system. New applications of FPC are not only portable equipment but larger one such as automotive application. In automotive application, electronic and thermal property of FPC is qualified. FPC contributes to make electronic equipment small then the material used could be reduced. Using FPC the concept of LCR (Least Consumer Release) will be accelerated.