Michael MelzerDaniil KarnaushenkoGungun LinS. BaunackDenys MakarovOliver G. Schmidt
The inside front cover highlights the breakthrough from rigid silicon-based magnetoelectronic devices to soft and compliant ones. On page 1333, M. Melzer, D. Makarov, and co-workers describe a method to transfer entire magnetoresistive microsensor structures from a rigid silicon substrate to a pre-stretched rubber membrane in a single step. This fabrication route overcomes several limitations of previous approaches to compliant magnetoelectronics and allows for invariance versus stretching up to 30%.
Michael MelzerDaniil KarnaushenkoGungun LinS. BaunackDenys MakarovOliver G. Schmidt
Han‐Byeol LeeChan‐Wool BaeLe Thai DuyIl‐Yung SohnDo‐Il KimYou‐Joon SongY.Y. KimNae‐Eung Lee
Kyoseung SimZhoulyu RaoFaheem ErshadCunjiang Yu
Niko MünzenriederGiuseppe CantarellaChristian VogtLuisa PettiLars BütheGiovanni A. SalvatoreFang YangRenzo AndriYawhuei LamRafael LibanoriDaniel WidnerAndré R. StudartGerhard Tröster
Yewang SuXuecheng PingKi Jun YuJungwoo LeeJonathan A. FanBo WangMing LiRui LiDaniel V. HarburgYongAn HuangCunjiang YuShimin MaoJaehoun ShimQinglin YangPei‐Yin LeeAgne ArmonasKi‐Joong ChoiYichen YangUngyu PaikTammy ChangThomas J. DawidczykYonggang HuangShuodao WangJohn A. Rogers