Multi-level interconnects for heterojunction bipolar transistor integrated circuit technologies

Gary A. Patrizi; M. L. Lovejoy; P.M. Enquist; Richard Schneider; Hong Q. Hou

doi:10.1016/s0040-6090(96)09058-x

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Multi-level interconnects for heterojunction bipolar transistor integrated circuit technologies

Gary A. Patrizi M. L. Lovejoy P.M. Enquist Richard Schneider Hong Q. Hou

Year: 1996 Journal: Thin Solid Films Vol: 290-291 Pages: 435-439 Publisher: Elsevier BV

DOI: 10.1016/s0040-6090(96)09058-x

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Keywords:

Materials science Chemical-mechanical planarization Benzocyclobutene Heterojunction bipolar transistor Optoelectronics Interconnection Bipolar junction transistor Common emitter Integrated circuit Heterojunction Fabrication Etching (microfabrication) Transistor Electrical engineering Nanotechnology Computer science Layer (electronics) Engineering Voltage

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Semiconductor materials and devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Multi-level interconnects for heterojunction bipolar transistor integrated circuit technologies

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