Sidewall restoration of porous ultra low-k dielectrics for sub-45nm technology nodes

H. Chaabouni; L.L. Chapelon; M. Aimadeddine; J. Vitiello; A. Farcy; R. Delsol; P. Brun; Davide Fossati; V. Arnal; T. Chevolleau; O. Joubert; J. Torrès

doi:10.1016/j.mee.2007.05.029

JOURNAL ARTICLE

Sidewall restoration of porous ultra low-k dielectrics for sub-45nm technology nodes

H. Chaabouni L.L. Chapelon M. Aimadeddine J. Vitiello A. Farcy R. Delsol P. Brun Davide Fossati V. Arnal T. Chevolleau O. Joubert J. Torrès

Year: 2007 Journal: Microelectronic Engineering Vol: 84 (11)Pages: 2595-2599 Publisher: Elsevier BV

DOI: 10.1016/j.mee.2007.05.029

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Keywords:

Dielectric Materials science Ashing Porosity Etching (microfabrication) Reliability (semiconductor) Low-k dielectric Optoelectronics Nanotechnology Composite material Layer (electronics)

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Semiconductor materials and devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Nanoporous metals and alloys

Physical Sciences → Materials Science → Materials Chemistry

Sidewall restoration of porous ultra low-k dielectrics for sub-45nm technology nodes

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