JOURNAL ARTICLE

Hydrogen evolution in aluminum plasma deposited silicon nitride layered structures

Takamaro KikkawaHeiji WatanabeTetsuhito Murata

Year: 1987 Journal:   Applied Physics Letters Vol: 50 (21)Pages: 1527-1529   Publisher: American Institute of Physics

Abstract

Blisters and voids in aluminum plasma enhanced chemical vapor deposited silicon nitride layered structures are studied. Results from evolved gas analysis have indicated release of hydrogen. Hydrogen evolution from silicon/nitride/aluminum/phosphosilicate glass/silicon layered structure showed a sharp peak in the temperature range between 580 and 660 °C. The results indicated that the accumulation of high pressure hydrogen gas evolved from the silicon nitride film and trapped at the aluminum silicon nitride interface could be the most dominant mechanism of the blister and void formation.

Keywords:
Silicon Materials science Void (composites) Hydrogen Nitride Silicon nitride Blisters Aluminium Plasma Chemical vapor deposition Chemical engineering Composite material Metallurgy Nanotechnology Layer (electronics) Chemistry

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Topics

Advanced ceramic materials synthesis
Physical Sciences →  Materials Science →  Ceramics and Composites
Acoustic Wave Resonator Technologies
Physical Sciences →  Engineering →  Biomedical Engineering
Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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