In recent years polycrystalline silicon deposited by chemical vapor deposition has become of importance in many semiconductor applications. The formation and properties of films deposited for different applications are reviewed in this paper, and the use of the films in semiconductor devices is discussed. The deposition temperature, gases, and impurities are found to have the major influence on the properties of the films. These deposition variables significantly affect the crystal
Andreas L. HoernerJoerg VierhausEdmund P. Burte