Studies of the mechanical and electrical properties of lead-free solder joints

S. K. Kang; Wooseok Choi; Myung Jin Yim; Da‐Yuan Shih

doi:10.1007/s11664-002-0023-9

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Studies of the mechanical and electrical properties of lead-free solder joints

S. K. Kang Wooseok Choi Myung Jin Yim Da‐Yuan Shih

Year: 2002 Journal: Journal of Electronic Materials Vol: 31 (11)Pages: 1292-1303 Publisher: Springer Science+Business Media

DOI: 10.1007/s11664-002-0023-9

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Keywords:

Soldering Intermetallic Materials science Joint (building) Microstructure Shear strength (soil) Metallurgy Surface finish Composite material Brass Electrical contacts Copper Direct shear test Shear (geology) Alloy Structural engineering

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Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Welding Techniques Analysis

Physical Sciences → Engineering → Mechanical Engineering

Studies of the mechanical and electrical properties of lead-free solder joints

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Citation History

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