JOURNAL ARTICLE
Microstructure and Mechanical Properties of Lead-Free Solder Joints
Year: 2015 Journal: Acta Physica Polonica A Vol: 128 (4)Pages: 750-753 Publisher: Polish Academy of Sciences
Abstract
In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and SnCu based solders.We simulated the wave soldering process and subsequent ageing both at dierent temperatures and reaction times.The near eutectic Sn0.7Cu alloy and Ni enriched Sn0.7Cu0.05Nialloy were studied.Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces.
Keywords:
Soldering Microstructure Materials science Lead (geology) Composite material Metallurgy
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Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Advanced Welding Techniques Analysis
Physical Sciences → Engineering → Mechanical Engineering
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DISSERTATION
Study of microstructures and mechanical properties of lead-free solder joints
Year: 2007