JOURNAL ARTICLE
Flexible printed circuit boards laser bonding using a laser beam homogenization process
Year: 2012 Journal: Optics and Lasers in Engineering Vol: 50 (11)Pages: 1643-1653 Publisher: Elsevier BV
Keywords:
Materials science Laser Printed circuit board Laser power scaling Laser beam quality Power density Wire bonding Optics Optoelectronics Composite material Laser beams Power (physics) Computer science Telecommunications
Metrics
8
Cited By
0.44
FWCI (Field Weighted Citation Impact)
20
Refs
0.67
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Semiconductor Lasers and Optical Devices
Physical Sciences → Engineering → Electrical and Electronic Engineering
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