JOURNAL ARTICLE

Flexible printed circuit boards laser bonding using a laser beam homogenization process

Joohan KimHae-Woon Choi

Year: 2012 Journal:   Optics and Lasers in Engineering Vol: 50 (11)Pages: 1643-1653   Publisher: Elsevier BV
Keywords:
Materials science Laser Printed circuit board Laser power scaling Laser beam quality Power density Wire bonding Optics Optoelectronics Composite material Laser beams Power (physics) Computer science Telecommunications

Metrics

8
Cited By
0.44
FWCI (Field Weighted Citation Impact)
20
Refs
0.67
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Semiconductor Lasers and Optical Devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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