JOURNAL ARTICLE
Predicting tensile properties of the bulk 96.5Sn-3.5Ag lead-free solder
Year: 2003 Journal: Journal of Electronic Materials Vol: 32 (6)Pages: 535-540 Publisher: Springer Science+Business Media
Keywords:
Materials science Ultimate tensile strength Eutectic system Soldering Composite material Elongation Void (composites) Creep Viscoelasticity Modulus Porosity Young's modulus Tensile testing Microstructure
Metrics
12
Cited By
0.94
FWCI (Field Weighted Citation Impact)
21
Refs
0.76
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Metallurgy and Material Forming
Physical Sciences → Engineering → Mechanics of Materials
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