JOURNAL ARTICLE

Predicting tensile properties of the bulk 96.5Sn-3.5Ag lead-free solder

Yi‐Wen ChengThomas A. Siewert

Year: 2003 Journal:   Journal of Electronic Materials Vol: 32 (6)Pages: 535-540   Publisher: Springer Science+Business Media
Keywords:
Materials science Ultimate tensile strength Eutectic system Soldering Composite material Elongation Void (composites) Creep Viscoelasticity Modulus Porosity Young's modulus Tensile testing Microstructure

Metrics

12
Cited By
0.94
FWCI (Field Weighted Citation Impact)
21
Refs
0.76
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Metallurgy and Material Forming
Physical Sciences →  Engineering →  Mechanics of Materials

Related Documents

JOURNAL ARTICLE

Fatigue crack growth behavior of 96.5Sn–3.5Ag lead-free solder

Jianguo Zhao

Journal:   International Journal of Fatigue Year: 2001 Vol: 23 (8)Pages: 723-731
JOURNAL ARTICLE

Impact Tensile Properties of Sn-3.5Ag-0.7Cu Lead-free Solder

Ken KaminisiShigeyuki HaruyamaHirohide KaidaFumitoshi OGAWAKousuke UEMORI

Journal:   The Proceedings of Conference of Kyushu Branch Year: 2002 Vol: 2002.55 (0)Pages: 31-32
JOURNAL ARTICLE

Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag

Chaosuan KanchanomaiYukio MIYASHITAYoshiharu MUTOH

Journal:   Journal of Electronic Materials Year: 2002 Vol: 31 (2)Pages: 142-151
JOURNAL ARTICLE

Low Cycle Fatigue Behavior and Mechanisms of a Lead-free Solder 3.5Ag/96.5Sn(Electronic Devices)

Chaosuan KanchanomaiYukio MIYASHITAYoshiharu MUTOH

Journal:   Proceedings of the Asian Pacific Conference on Fracture and Strength and International Conference on Advanced Technology in Experimental Mechanics Year: 2001 Vol: 2.01.03 (0)Pages: 941-947
© 2026 ScienceGate Book Chapters — All rights reserved.