JOURNAL ARTICLE
Fatigue crack growth behavior of 96.5Sn–3.5Ag lead-free solder
Year: 2001 Journal: International Journal of Fatigue Vol: 23 (8)Pages: 723-731 Publisher: Elsevier BV
Keywords:
Materials science Intermetallic Intergranular corrosion Soldering Paris' law Eutectic system Metallurgy Transgranular fracture Intergranular fracture Stress concentration Stress (linguistics) Crack closure Composite material Fracture mechanics Microstructure Alloy
Metrics
60
Cited By
4.38
FWCI (Field Weighted Citation Impact)
23
Refs
0.95
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Advanced Welding Techniques Analysis
Physical Sciences → Engineering → Mechanical Engineering
Intermetallics and Advanced Alloy Properties
Physical Sciences → Engineering → Mechanical Engineering
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