Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes

Abstract

Solder joint reliability of lead free solders (Sn-Ag-Cu) in drop testing has been an issue in mobile and handheld electronics. Since lead free solders have lower drop performance compared with Pb-Sn solders, many efforts have been reported to improve solder joint reliability with various lead free solders. In this study, standard JEDEC drop reliability tests were performed for a CSP (chip scale package) prepared with two different compositions of lead free solders (SAC405 alloy: Sn-4Ag-0.5Cu and SAC105 alloy: Sn-1Ag-0.5Cu). Lead free solders were assembled on substrates with a Au/Ni surface finish. It was seen that SAC 105 alloy solder demonstrated better drop reliability compared with SAC405 alloy solder and failure analysis conducted to understand the differences in failure modes & drop reliability performance.. The fundamental cause of improved drop reliability performance of SAC 105 solders and the advantages of using low Ag content SAC lead free solders for microelectronic devices is discussed. Finally, a finite element model was developed and validated with failure analysis to investigate the high stress concentration distribution and failure mode in solder joints for drop test stress conditions.