JOURNAL ARTICLE

Current understanding of annealing texture evolution in thin films and interconnects

Dong Nyung Lee

Year: 2005 Journal:   Zeitschrift für Metallkunde Vol: 96 (3)Pages: 259-268   Publisher: De Gruyter

Abstract

Abstract When deposits obtained by physical and chemical vapor deposition, electrodeposition, and electroless-deposition are annealed, they undergo recrystallization or abnormal grain growth to reduce their energy stored during deposition. The driving force for recrystallization is mainly due to dislocations, whereas that for abnormal grain growth is due to grain boundary energy, surface energy, interface energy or strain energy, or their combinations. During recrystallization and abnormal grain growth, a texture change can take place. Models for the evolution of recrystallization and abnormal grain growth textures are discussed.

Keywords:
Annealing (glass) Materials science Thin film Texture (cosmology) Metallurgy Condensed matter physics Engineering physics Nanotechnology Computer science Physics Artificial intelligence

Metrics

20
Cited By
0.92
FWCI (Field Weighted Citation Impact)
24
Refs
0.71
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials
Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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