Wafer bonded silicon photonics

Di Liang; Alexander W. Fang; Huiwen Chen; John E. Bowers

doi:10.1109/avfop.2008.4653168

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JOURNAL ARTICLE

Wafer bonded silicon photonics

Di Liang Alexander W. Fang Huiwen Chen John E. Bowers

Year: 2008 Pages: 45-46

DOI: 10.1109/avfop.2008.4653168

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Abstract

100 mm wafer-scale InP-to-silicon bonding is demonstrated for hybrid silicon evanescent platform. Distributed feedback lasers and phase modulators are also implemented in this platform very recent

Keywords:

Wafer Silicon Silicon photonics Wafer bonding Materials science Hybrid silicon laser Photonics Optoelectronics Wafer-scale integration Laser Electronic engineering Nanotechnology Optics Engineering Physics

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Topics

Photonic and Optical Devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Semiconductor Lasers and Optical Devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Photonic Crystals and Applications

Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics

Wafer bonded silicon photonics

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