Milica NotarosThomas D. DyerAshton HattoriKevin FealeySeth KrugerJelena Notaroš
We develop a wafer-scale CMOS-compatible platform and fabrication process that results in 300-mm-diameter flexible wafers, and experimentally demonstrate key functionality at visible wavelengths, including chip coupling, waveguide routing, and passive devices.
Milica NotarosThomas DyerAndres Garcia ColetoAshton HattoriKevin FealeySeth KrugerJelena Notaroš
Margot NielsEwoud VissersTom VanackereArno MoermanXiujun ZhengXin GuoPeter GeerinckEmadreza SoltanianJing ZhangSofie JanssenPeter VerheyenNeha SinghDieter BodeMartin DaviFilippo FerraroP. AbsilSadhishkumar BalakrishnanJoris Van CampenhoutSebastian HänschHanh MaiNishant SinghGunther RoelkensSarah UvinMaximilien BilletBart Kuyken
Pranta SahaSridhar MajetyVictoria A. NormanAlex H. RubinScott DhueyMarina Radulaski
Roberto R. PanepucciAbdullah J. ZakariyaLavanya V. K. Kudapa