A single-mask dry-release process for fabrication of high aspect ratio SOI MEMS devices

Zhenchuan Yang; Yumin Wei; Xu Mao; Guizhen Yan

doi:10.1007/s11431-012-5089-x

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A single-mask dry-release process for fabrication of high aspect ratio SOI MEMS devices

Zhenchuan Yang Yumin Wei Xu Mao Guizhen Yan

Year: 2012 Journal: Science China Technological Sciences Vol: 56 (2)Pages: 387-391 Publisher: Springer Science+Business Media

DOI: 10.1007/s11431-012-5089-x

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Keywords:

Deep reactive-ion etching Fabrication Microelectromechanical systems Materials science Silicon on insulator Etching (microfabrication) Accelerometer Optoelectronics Capacitive sensing Dry etching Silicon Reactive-ion etching Nanotechnology Electrical engineering Engineering Computer science

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Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Surface Polishing Techniques

Physical Sciences → Engineering → Biomedical Engineering

Acoustic Wave Resonator Technologies

Physical Sciences → Engineering → Biomedical Engineering

A single-mask dry-release process for fabrication of high aspect ratio SOI MEMS devices

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