Operational and design approaches to computer integrated manufacturing in electronics manufacturing and assembly

Abstract

Summary form only given. The author has investigated approaches and algorithms for achieving computer-integrated manufacturing in the following aspects of electronics assembly and manufacturing: real-time control for responding to machine failures in flexible assembly cells; planning and scheduling in multistate systems with random yields or reentrant structure; multifacility coordination and material flows in vertically integrated stages of computer assembly; and product and process design in very-large-scale integration and printed-circuit-board assembly systems. He has developed an approach for real-time control of a flexible assembly cell for chip insertion onto printed-circuit boards based on a hierarchical structure and a release policy for multistate systems subject to random-yield or a reentrant structure such as test stages in a printed-circuit board line or the front end of a VLSI facility. Combined component ordering and facility manufacturing management policies have been developed for integrated manufacturing environments with IC chip facilities in cascade with printed-circuit-board facilities, which in turn meet demand from the final computer assembly plants.< >