JOURNAL ARTICLE

IC packages capacitance calculations using finite element method

Keywords:
Finite element method Capacitance Computer science Materials science Electronic engineering Physics Engineering Structural engineering Electrode

Metrics

2
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.04
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electromagnetic Compatibility and Noise Suppression
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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