JOURNAL ARTICLE
IC packages capacitance calculations using finite element method
Keywords:
Finite element method Capacitance Computer science Materials science Electronic engineering Physics Engineering Structural engineering Electrode
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2
Cited By
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FWCI (Field Weighted Citation Impact)
0
Refs
0.04
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electromagnetic Compatibility and Noise Suppression
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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