JOURNAL ARTICLE

Fatigue Characterization for Flexible Circuit with Polyimide on Adhesiveless Copper

Kuo-Hua HuangJenq‐Gong Duh

Year: 2015 Journal:   Journal of Electronic Materials Vol: 44 (10)Pages: 3934-3941   Publisher: Springer Science+Business Media
Keywords:
Polyimide Relative humidity Copper Flexibility (engineering) Materials science Microstructure Characterization (materials science) Humidity Composite material Residual Computer science Metallurgy Nanotechnology Layer (electronics) Mathematics

Metrics

4
Cited By
0.17
FWCI (Field Weighted Citation Impact)
10
Refs
0.56
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced Sensor and Energy Harvesting Materials
Physical Sciences →  Engineering →  Biomedical Engineering
Synthesis and properties of polymers
Physical Sciences →  Materials Science →  Polymers and Plastics
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