JOURNAL ARTICLE
Fatigue Characterization for Flexible Circuit with Polyimide on Adhesiveless Copper
Year: 2015 Journal: Journal of Electronic Materials Vol: 44 (10)Pages: 3934-3941 Publisher: Springer Science+Business Media
Keywords:
Polyimide Relative humidity Copper Flexibility (engineering) Materials science Microstructure Characterization (materials science) Humidity Composite material Residual Computer science Metallurgy Nanotechnology Layer (electronics) Mathematics
Metrics
4
Cited By
0.17
FWCI (Field Weighted Citation Impact)
10
Refs
0.56
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Advanced Sensor and Energy Harvesting Materials
Physical Sciences → Engineering → Biomedical Engineering
Synthesis and properties of polymers
Physical Sciences → Materials Science → Polymers and Plastics
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