Topology Conversions of Non-Interpenetrated Metal–Organic\nFrameworks to Doubly Interpenetrated Metal–Organic Frameworks

Abstract

Non-interpenetrated\nthree-dimensional (3D) metal–organic\nframeworks (MOFs) with both an interpenetration-favorable (3,5)-c <b>hms</b> topology and an interpenetration-unfavorable (3,5)-c <b>gra</b> topology are converted to doubly interpenetrated analogues\nwith <b>hms-c</b> topology by thermal treatment, even in the\nabsence of solvent. Depending on the conversion temperature and the\nproperties of the pillaring ligand in the non-interpenetrated 3D MOF,\nwhich is based on two-dimensional sheets with 3-c <b>hcb</b> topology pillared by neutral ditopic linkers, the pillaring ligands\nin the interpenetrated MOFs produced are partially removed during\nthe thermal conversions, leading to interpenetrated MOFs that simultaneously\ncontain both micro- and mesopores.