Abstract

Herein, we report an atomic layer\ndeposition (ALD) process for\nCu<sub>2</sub>O thin films using copper­(II) acetate [Cu­(OAc)<sub>2</sub>] and water vapor as precursors. This precursor combination enables\nthe deposition of phase-pure, polycrystalline, and impurity-free Cu<sub>2</sub>O thin films at temperatures of 180–220 °C. The\ndeposition of Cu­(I) oxide films from a Cu­(II) precursor without the\nuse of a reducing agent is explained by the thermally induced reduction\nof Cu­(OAc)<sub>2</sub> to the volatile copper­(I) acetate, CuOAc. In\naddition to the optimization of ALD process parameters and characterization\nof film properties, we studied the Cu<sub>2</sub>O films in the fabrication\nof photoconductor devices. Our proof-of-concept devices show that\napproximately 20 nm thick Cu<sub>2</sub>O films can be used for photodetection\nin the visible wavelength range and that the thin film photoconductors\nexhibit improved device characteristics in comparison to bulk Cu<sub>2</sub>O crystals.

Keywords:
Thin film Atomic layer deposition Photoconductivity Deposition (geology) Layer (electronics) Chemical vapor deposition Oxide Wavelength Combustion chemical vapor deposition

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Topics

Copper-based nanomaterials and applications
Physical Sciences →  Materials Science →  Materials Chemistry
Dielectric properties of ceramics
Physical Sciences →  Materials Science →  Materials Chemistry
Electron and X-Ray Spectroscopy Techniques
Physical Sciences →  Materials Science →  Surfaces, Coatings and Films

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M. Ohkubo

Journal:   Materials science forum Year: 1993 Vol: 130-132 Pages: 143-162
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