Three-Dimensional\nMetallic Surface Micropatterning\nthrough Tailored Photolithography–Transfer–Plating

Abstract

Precise micropatterning\non three-dimensional (3D) surfaces\nis desired\nfor a variety of applications, from microelectronics to metamaterials,\nwhich can be realized by transfer printing techniques. However, a\nnontrivial deficiency of this approach is that the transferred microstructures\nare adsorbed on the target surface with weak adhesion, limiting the\napplications to external force-free conditions. We propose a scalable\n“photolithography–transfer–plating” method\nto pattern stable and durable microstructures on 3D metallic surfaces\nwith precise dimension and location control of the micropatterns.\nSurface patterning on metallic parts with different metals and isotropic\nand anisotropic curvatures is showcased. This method can also fabricate\nhierarchical structures with nanoscale vertical and microscale horizontal\ndimensions. The plated patterns are stable enough to mold soft materials,\nand the structure durability is validated by 24 h thermofluidic tests.\nWe demonstrate micropatterned nickel electrodes for oxygen evolution\nreaction acceleration in hydrogen production, showing the potential\nof micropatterned 3D metallic surfaces for energy applications.