Hongbo Gu (135205)Jiang Guo (829666)Qingliang He (1492285)Sruthi Tadakamalla (1948636)Xi Zhang (83736)Xingru Yan (1630273)Yudong Huang (1948639)Henry A. Colorado (1948642)Suying Wei (1492300)Zhanhu Guo (1492291)
Epoxy resin nanocomposites reinforced\nwith silica nanoparticles have been prepared at different nanoparticle\nloading levels. The surface functionality of the silica nanoparticles\nis manipulated by the phosphoric acid (H<sub>3</sub>PO<sub>4</sub>)-doped conductive polyaniline (PANI) via a surface initiated polymerization\n(SIP) method. The improved glass transition temperature (<i>T</i><sub>g</sub>) and enhanced mechanical properties of the cured epoxy\nresin nanocomposites filled with the functionalized silica nanoparticles\nare observed compared with those of the cured pure epoxy resin. The\nflammability and thermal stability behaviors of these nanocomposites\nare evaluated using microscale combustion calorimeter (MCC) and thermogravimetric\nanalysis (TGA). The heat release rate (HRR) peak of the epoxy filled\nwith functionalized silica nanoparticles is observed to decrease dramatically\nwith increasing functionalized silica particle loadings, indicating\na flame-retardant performance from the phosphoric acid-doped PANI.
Hongbo GuJiang GuoQingliang HeSruthi TadakamallaXi ZhangXingru YanYudong HuangHenry A. ColoradoSuying WeiZhanhu Guo
Hongbo Gu (135205)Sruthi Tadakamalla (1948636)Yudong Huang (1948639)Henry A. Colorado (1948642)Zhiping Luo (234715)Neel Haldolaarachchige (1685557)David P. Young (1576102)Suying Wei (1492300)Zhanhu Guo (1492291)
Mayu SiJonathan HefterAndrew SongMiriam RafailovichJonathan Sokolov
Hongbo GuSruthi TadakamallaYudong HuangHenry A. ColoradoZhiping LuoNeel HaldolaarachchigeDavid P. YoungSuying WeiZhanhu Guo
Hongbo GuSruthi TadakamallaXi ZhangYudong HuangYuan JiangHenry A. ColoradoZhiping LuoSuying WeiZhanhu Guo