JOURNAL ARTICLE

Printing Nanostructured Copper for Electromagnetic\nInterference Shielding

Aaron Sheng (3552122)Jian Yu (141239)Shenqiang Ren (1438135)

Year: 2022 Journal:   OPAL (Open@LaTrobe) (La Trobe University)   Publisher: La Trobe University

Abstract

Printing metallic nanomaterials toward\nelectromagnetic interference\nshielding is highly desirable, especially with a minimal thickness\nand mechanical flexibility. Here, we report the geometry and conductivity\neffects of printed nanostructured copper on the reflection and absorption\nof electromagnetic interference shielding. The electromagnetic interference\nshielding is observed to increase as the conductivity increases with\nthe optimum electromagnetic interference shielding effectiveness of\n65 dB, on which a shielding effectiveness diagram is constructed to\nillustrate the role of electric conductivity and architectures of\nprinted nanostructured copper features. The findings reported here\nprovide insight into printed flexible metallic materials for electromagnetic\ninterference shielding.

Keywords:
Electromagnetic shielding Copper Nanomaterials Reflection (computer programming) Electromagnetic interference Conductivity Electrical resistivity and conductivity 3d printed

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Topics

Mycorrhizal Fungi and Plant Interactions
Life Sciences →  Agricultural and Biological Sciences →  Plant Science
Genomics and Phylogenetic Studies
Life Sciences →  Biochemistry, Genetics and Molecular Biology →  Molecular Biology
Plant Pathogens and Fungal Diseases
Life Sciences →  Biochemistry, Genetics and Molecular Biology →  Cell Biology

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