Study on mechanical and thermal properties of a modified epoxy resin

Abstract

The uniaxial tensile test, linear expansion coefficient test of a modified epoxy resin in the ambient temperature range from -35℃ to 120℃, and the impact test at room temperature were carried out to explore its mechanical and thermal characteristics under temperature change environment. The constitutive model of the material suitable for temperature change environment is deduced, the numerical calculation is carried out in MATLAB, compared with the relative tested curve, and the obtained constitutive model is applied to the modeling calculation in ABAQUS and the results are verified. The results show that the modified epoxy resin has better strength, stiffness, impact toughness and lower coefficient of linear expansion than common epoxy resins such as E-44, E-51 and EPON e863. The material is suitable to be used as the matrix of spaceborne electronic component potting module. The proposed empirical constitutive model can obtain the stress-strain relationship of the material at any temperature in the range of -35℃~120℃ through interpolation, and can be directly used in relevant damage analysis and life prediction of electronic component potting module. The research method and derivation results have engineering reference value.