BOOK-CHAPTER
Underfill adhesive materials for flip chip applications
Year: 2011 Elsevier eBooks Pages: 137-154 Publisher: Elsevier BV
Keywords:
Flip chip Adhesive Materials science Chip Flip Composite material Computer science Telecommunications Chemistry
Metrics
9
Cited By
1.09
FWCI (Field Weighted Citation Impact)
10
Refs
0.76
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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