Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages

Muhammad Nizam Ilias; Maria Abu Bakar; Azman Jalar; Adlil Aizat Ismail; Erwan Basiron; S. P. Low

doi:10.1007/s11668-025-02256-x

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Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages

Muhammad Nizam Ilias Maria Abu Bakar Azman Jalar Adlil Aizat Ismail Erwan Basiron S. P. Low

Year: 2025 Journal: Journal of Failure Analysis and Prevention Vol: 25 (4)Pages: 1946-1959 Publisher: Springer Science+Business Media

DOI: 10.1007/s11668-025-02256-x

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

VLSI and Analog Circuit Testing

Physical Sciences → Computer Science → Hardware and Architecture

Integrated Circuits and Semiconductor Failure Analysis

Physical Sciences → Engineering → Electrical and Electronic Engineering

Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages

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