Wafer-to-Wafer Hybrid Bonding Technology with 300nm Interconnect Pitch

Stefaan Van Huylenbroeck; Soon Aik Chew; Boyao Zhang; Lieve Bogaerts; Cindy Heyvaert; Sven Dewilde; Serena Iacovo; Michele Stucchi; Joeri De Vos; Gerald Beyer; Eric Beyne

doi:10.1109/ectc51687.2025.00100

JOURNAL ARTICLE

Wafer-to-Wafer Hybrid Bonding Technology with 300nm Interconnect Pitch

Stefaan Van Huylenbroeck Soon Aik Chew Boyao Zhang Lieve Bogaerts Cindy Heyvaert Sven Dewilde Serena Iacovo Michele Stucchi Joeri De Vos Gerald Beyer Eric Beyne

Year: 2025 Pages: 550-554

DOI: 10.1109/ectc51687.2025.00100

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Keywords:

Wafer Wafer bonding Interconnection Materials science Wafer-scale integration Optoelectronics Wafer-level packaging Die preparation Wafer backgrinding Electronic engineering Computer science Engineering Wafer dicing Telecommunications

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3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Integrated Circuits and Semiconductor Failure Analysis

Physical Sciences → Engineering → Electrical and Electronic Engineering

Wafer-to-Wafer Hybrid Bonding Technology with 300nm Interconnect Pitch

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