Keywords:
Wafer Wafer bonding Interconnection Materials science Wafer-scale integration Optoelectronics Wafer-level packaging Die preparation Wafer backgrinding Electronic engineering Computer science Engineering Wafer dicing Telecommunications

Metrics

1
Cited By
2.02
FWCI (Field Weighted Citation Impact)
4
Refs
0.78
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Integrated Circuits and Semiconductor Failure Analysis
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
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