Enhanced thermal conductivity and thermal shock resistance in diamond/copper composites through diamond surface etching

Zonghui Su; Kai Han; Zhijie Ye; Jiwen Zhao; Wenxin Cao; Jiaqi Zhu

doi:10.1016/j.matlet.2025.138229

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Enhanced thermal conductivity and thermal shock resistance in diamond/copper composites through diamond surface etching

Zonghui Su Kai Han Zhijie Ye Jiwen Zhao Wenxin Cao Jiaqi Zhu

Year: 2025 Journal: Materials Letters Vol: 387 Pages: 138229-138229 Publisher: Elsevier BV

DOI: 10.1016/j.matlet.2025.138229

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Keywords:

Materials science Diamond Thermal conductivity Thermal shock Composite material Copper Etching (microfabrication) Interfacial thermal resistance Thermal resistance Thermal Metallurgy

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Diamond and Carbon-based Materials Research

Physical Sciences → Materials Science → Materials Chemistry

Thermal properties of materials

Physical Sciences → Materials Science → Materials Chemistry

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Enhanced thermal conductivity and thermal shock resistance in diamond/copper composites through diamond surface etching

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Citation History

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