JOURNAL ARTICLE
Invited Paper: Low-Temperature SiO2/SiO2 Wafer Direct Bonding by N2 Plasma Activation
Keywords:
Wafer Materials science Plasma Wafer bonding Direct bonding Plasma chemistry Optoelectronics Temperature measurement Engineering physics Physics Thermodynamics Nuclear physics
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Topics
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Semiconductor materials and devices
Physical Sciences → Engineering → Electrical and Electronic Engineering
Thin-Film Transistor Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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