Solution-Based Processing of Two-Dimensional Materials for High-Performance and Wafer-Scale Electronics

Abstract

The integration of two-dimensional (2D) materials into practical electronics has been hindered by the lack of scalable fabrication methods. To overcome the limitation, I will introduce a general approach for wafer-scale electronics based on 2D nanomaterial inks, which is fabricated by molecular intercalation-assisted exfoliation method, enabling highly uniform, ultrathin, phase-pure, and large lateral size 2D nanoflakes. This approach enables the printing of large-area thin films characterized by effective van der Waals (vdW) sheet-to-sheet contacts, which promote a clean interface and minimal charge trapping states. We demonstrate the versatility of the printed thin films by integrating them with various electrical functionalities—dielectric, semiconducting, and metallic—resulting in vdW thin-film devices that exhibit exceptional performance over large scales. These devices not only enhance current electronics but also expand potential applications to include photodetectors, diode, and logic gates, demonstrating their broad utility in advanced electronic systems.