Plasma etching of silicon carbide trenches with high aspect ratio and rounded corners

JOURNAL ARTICLE

Year: 2024 Journal: Materials Science in Semiconductor Processing Vol: 188 Pages: 109172-109172 Publisher: Elsevier BV

DOI: 10.1016/j.mssp.2024.109172

Keywords:

Materials science Silicon carbide Etching (microfabrication) Aspect ratio (aeronautics) Plasma etching Carbide Silicon Composite material Metallurgy

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0.83

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