JOURNAL ARTICLE
Substrate Embedded Power Electronics Packaging for Silicon Carbide mosfets
Ameer JanabiLuke ShillaberWucheng YingWei MuBorong HuYunlei JiangNikolaos IosifidisLi RanTeng Long
Year: 2024 Journal: IEEE Transactions on Power Electronics Vol: 39 (8)Pages: 9614-9628 Publisher: Institute of Electrical and Electronics Engineers
Keywords:
Silicon carbide Materials science Silicon Power electronics Substrate (aquarium) Power semiconductor device Optoelectronics Electronics Power MOSFET Electrical engineering MOSFET Engineering physics Power module Hybrid silicon laser Power (physics) Transistor Engineering Voltage Metallurgy Physics
Metrics
8
Cited By
2.95
FWCI (Field Weighted Citation Impact)
38
Refs
0.86
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Silicon Carbide Semiconductor Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electromagnetic Compatibility and Noise Suppression
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Related Documents
BOOK-CHAPTER
Silicon Carbide Power Electronics Packaging
Jared HornbergerBrice McPhersonBrandon Passmore
Year: 2013 Pages: 803-818
JOURNAL ARTICLE
470 Celsius Packaging System for Silicon Carbide Electronics
N. ChiolinoA. Matthew FrancisJames HolmesMatthew BarlowCasey Perkowski
Journal: Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) Year: 2021 Vol: 2021 (HiTEC)Pages: 000083-000088
JOURNAL ARTICLE
Emerging silicon carbide power electronics components
Journal: Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Year: 2005 Vol: 1 Pages: 11-17
JOURNAL ARTICLE
Silicon carbide power electronic module packaging
Shaowei HeLongcheng QueJian LvSimon S. Ang
Year: 2015 Pages: 483-486