A Rapid and Selective Laser Sintering Method of Silver Nanoparticles for High Temperature Electronic Devices Packaging

Abstract

This paper presents a laser-assisted sintering method of a silver nanoparticle paste for high temperature die-attach applications. Compared with the sintering time of tens of minutes based on the conventional hotplate-based method, an average shear strength of 9.7 MPa was obtained with a very short laser irradiation time of 1 minute, and the maximum shear strength was improved to 30.2 MPa by increasing the laser irradiation time to 5 minutes. In addition, from the morphology of the sample after a short-time laser sintering process, it can be observed that only the local area around the chip was oxidized. These results demonstrate that the laser-based sintering method is not only a significant way to improve the manufacturing efficiency, but also a localized and selective packaging method. Therefore, the laser-assisted sintering method can be used in the packaging of high temperature electronic devices or heterogeneous integration of chips with different shapes and operating temperatures.