4x4 Millimeter-Wave Patch Antenna Array for 5G Communication

Abstract

Antenna-in-package(AiP) has been extensive used in millimeter wave(mm wave) system integration. Fan-out wafer level packaging (FOWLP) can improve electrical performance, reduce thickness and thermal resistance, making it become the best suited packaging for mm wave applications. This paper presented a 4x4 series fed patch antenna array which consists of four patch antennas fed by a 1-to-4 feeding network. The proposed antenna uses HFSS software for simulation, and this designed array showed a high gain directional wide side radiation pattern of 15.83 dBi at 28 GHz. The performance of the proposed array is adequate for 5G mm wave communication applications at 28 GHz.