JOURNAL ARTICLE

Sustainable approach to electroless copper plating process

S. JothilakshmiS. RekhaU. NagabalanB. Kalpana

Year: 2024 Journal:   Transactions of the IMF Vol: 102 (3)Pages: 129-135   Publisher: Taylor & Francis

Abstract

The current study aims to meet Sustainable Development Goal (SDG)-12 sustainable consumption and production for electroless copper deposition. The study involves replacement of non-biodegradable chemicals with biodegradable materials. The present work utilises biodegradable D-Mannitol and eco-friendly copper methane sulphonate salt. The bath was stabilised with 2, 2′-dipyridyl and cetrimide. Gravimetric analysis and electrochemical studies viz. anodic polarisation, Tafel polarisation, cyclic voltammetry and impedance spectroscopy were carried out. Deposit morphology and structure were examined by scanning electron microscopy (SEM) and X-ray diffraction (XRD). 2,2′-dipyridyl and cetrimide were found to reduce the speed of chemical reduction of copper (II) to copper which helps to improve the stability of the bath at higher pH.

Keywords:
Copper Copper plating Metallurgy Plating (geology) Process (computing) Materials science Gold plating (software engineering) Electroless plating Environmental science Process engineering Engineering Computer science Nanotechnology Electroplating Geology Layer (electronics)

Metrics

4
Cited By
1.48
FWCI (Field Weighted Citation Impact)
35
Refs
0.75
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electrodeposition and Electroless Coatings
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Corrosion Behavior and Inhibition
Physical Sciences →  Materials Science →  Materials Chemistry
Nanoporous metals and alloys
Physical Sciences →  Materials Science →  Materials Chemistry

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