Kinetics of Contact Plating of Nickel on Aluminum from Alkaline Ammonia Solutions

A. F. Dresvyânnikov; Ya. V. Ivshin; M. G. Khairullin

doi:10.1023/a:1026677127382

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JOURNAL ARTICLE

Kinetics of Contact Plating of Nickel on Aluminum from Alkaline Ammonia Solutions

A. F. Dresvyânnikov Ya. V. Ivshin M. G. Khairullin

Year: 2000 Journal: Protection of Metals Vol: 36 (6)Pages: 551-554 Publisher: Springer Science+Business Media

DOI: 10.1023/a:1026677127382

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Keywords:

Dissolution Nickel Cathodic protection Exchange current density Deposition (geology) Cyclic voltammetry Voltammetry Materials science Inorganic chemistry Aluminium Ammonia Electrode Analytical Chemistry (journal) Chemistry Metallurgy Electrochemistry Physical chemistry Environmental chemistry

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Gas Sensing Nanomaterials and Sensors

Physical Sciences → Engineering → Electrical and Electronic Engineering

Metallurgical and Alloy Processes

Physical Sciences → Materials Science → General Materials Science

Corrosion Behavior and Inhibition

Physical Sciences → Materials Science → Materials Chemistry

Kinetics of Contact Plating of Nickel on Aluminum from Alkaline Ammonia Solutions

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