Numerical Investigations of the Thermal-Hydraulic Characteristics of Microchannel Heat Sinks Inspired by Leaf Veins

Abstract

A microchannel heat sink (MCHS) is a potential solution for chip and battery thermal management. The new microchannel structure is beneficial for further improving the thermal-hydraulic performance of MCHSs. Inspired by leaf veins, six new channel structures were designed, and the effects of the channel structures (three parallel structures named PAR I, II, and III and three pinnate structures named PIN I, II, and III), channel depths (0.4, 0.8, and 1.6 mm), and heat fluxes (20, 50, and 80 kW/m2) were investigated via numerical simulation. The cooling medium was water, and the heating area was 40 × 40 mm2. Both PAR II and PIN III exhibit superior overall performance, characterized by the highest Nusselt number and the lowest heating wall temperature. Moreover, PIN III demonstrates the lowest standard deviation in heating wall temperature, while PAR II exhibits the lowest friction factor. The greater the channel depth is, the larger the solid–liquid contact area is, leading to a reduced wall temperature at the interface under identical conditions of inlet Reynolds number and heating wall heat flux. Consequently, an increase in the Nusselt number corresponds to an increase in the friction factor. The maximum value and standard deviation of the heating wall temperature increase with increasing heat flux, while the Nusselt number and friction factor remain unaffected. The overheating near the two right angles of the outlet should be carefully considered for an MCHS with a single inlet–outlet configuration.