Stretchable Microscale Patterned Interconnects Formed on Micro-Corrugated Vertical Wavy Structured Substrate

Abstract

To realize high-density and low-electric-resistance stretchable interconnects, micro scale metal interconnects with vertical wavy structure is required. In this paper, we propose a new structure of stretchable micro scale patterned interconnect which is formed on a vertical wavy structured metal substrate with an insulating layer; the wavy structured metal substrate plays only the role of ensuring stretchability and the wiring part is formed separately, enabling the formation of stretchable micro scale patterned interconnect. To realize the proposed structure, the insulating layer and microscale patterned interconnects were formed on the metal substrate and then micro-corrugated to fabricate a vertical wavy structure. Our proposed process succeeded in fabricating interconnects with 50 $\mu \mathrm{m}$ width, and fabricated micro scale interconnects sustained a strain over 50%.