Reducing Electromagnetic Interference in Printed Circuit Board

Abstract

Electromagnetic interference (EMI) describes the phenomenon of unwanted noise and interference produced by external sources that disturb electronic devices. The focus of this review is to understand three methods that can be used to reduce EMI when designing printed circuit boards (PCB). One way is to have a good wiring design, different wiring designs reduce EMI differently. Compared to a common system, a separate grounded system reduces electromagnetic interference significantly. Electromagnetic interference can also be reduced by electromagnetic bandgap structure (EBG). The mitigation of switching noise due to radiation in high-speed PCBs is investigated using a parallel board bus configuration. The central frequency of the structure with EBG is substantially lower than that of the structure without EBG. The last method is to cover a shielded enclosure on the electronics device. Traditionally, it is made from conductive materials such as metals or alloys. It is gradually being replaced by some composites, such as conducting polymer-based shields, due to their better shielding effectiveness and mechanical properties.