Understanding Electrical Failure of Polyimide-Based Flexible Neural Implants: The Role of Thin Film Adhesion

Abstract

The lack of long-term stability of polymeric neural interfaces remains one of the most important and less tackled issues in this research field. To address this issue, we fabricated two test structures based on interdigitated electrodes (IDEs) encapsulated with polyimide (PI). One of the test samples was pretreated with barrel oxygen plasma prior to spin coating of the second PI layer. The second test structure was pretreated using a reactive ion etching (RIE) process. The test samples were immersed in an electrolyte solution at elevated temperatures to mimic the conditions inside the human brain. The samples were then electrically and mechanically stressed to accelerate their degradation. Real-time monitoring of the electrical insulation stability was used to compare the impact of the pretreatment on the long-term stability. Barrel-plasma-activated test samples showed a mean lifetime of 1.5 days, whereas RIE pretreatment increased the mean lifetime to 24 days. Therefore, RIE-pretreated test samples exhibited 16 times longer mean stability compared to purely chemically activated test samples. Furthermore, the electrical measurements were correlated with mechanical adhesion tests. Chemically activated test samples showed significant delamination, whereas RIE pretreatment enhanced the adhesion, and no delamination could be observed. The correlation of these investigations suggests that the adhesion between different layers is higher following RIE pretreatment compared to pretreatment with chemical barrel plasma. In conclusion, the adhesion between the two PI foils seems to play a key role in the long-term stability of such devices.